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indeed

Senior Staff Analog Layout Engineer

Synopsys
Karnataka, IND
Executive
Onsite
Discovered 1 months ago
Analog and mixed-signal custom IC layoutUCIe PHY layoutHigh-speed SerDes and die-to-die interface IPMicro bump planning and bump map architecture2.5D/3D integration and package co-designHigh-speed differential routing

Full Job Posting

Role overview

Design and deliver analog layouts for Synopsys UCIe PHY IP used in chiplet-based products.

Work across circuit design, package engineering, digital integration, and reliability teams.

The role emphasizes chiplet architectures, 2.5D integration, advanced packaging, and UCIe die-to-die interfaces.

Responsibilities

  • Design full-custom analog layouts for UCIe PHY transmitters, receivers, drivers, equalizers, DLLs, bias circuits, calibration engines, and regulators.
  • Execute PHY-level floor planning, bump planning, micro bump architecture, and channel routing with package co-design.
  • Implement high-speed differential routing with length matching, skew control, shielding, symmetry, and signal-integrity optimization.
  • Drive physical verification closure, including DRC, LVS, ERC, antenna, density, LPE, EM/IR, and reliability checks.
  • Integrate layouts with ASIC physical design flows, generate LEFs, support place-and-route, and resolve integration issues.
  • Develop methodologies, automation scripts, and reusable flows; lead reviews, mentor engineers, and drive tape-out execution.

Requirements

  • Diploma or bachelor's degree in Electrical Engineering, Electronics Engineering, or a related technical field.
  • 8 to 15 years of hands-on analog or mixed-signal custom IC layout experience.
  • Proven UCIe PHY, high-speed SerDes, or die-to-die interface IP layout experience with successful tape-outs.
  • Expertise in micro bump planning, bump maps, package-aware floor planning, and 2.5D/3D die/package co-design, including interposers, RDL, and TSVs.
  • Strong high-speed differential routing skills, including length matching, skew control, shielding, symmetry, and signal-integrity-driven layout.
  • Experience closing DRC, LVS, ERC, EM/IR, antenna, density, and reliability checks through advanced-node tape-out.
  • Experience integrating analog layouts with ASIC physical design flows.

Role impact

Layouts and bump architectures will support UCIe die-to-die interfaces and integration with digital logic, package substrates, and interposers.

Signal-integrity work affects high-speed channel performance in silicon; verification methods and automation aim to accelerate tape-out and reduce respins.

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