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FY27 Intern - Soft IP Engineering Internship - Canada (12 or 16 months)

Qualcomm
Ottawa, CAN
Internship
Intern
Onsite
$54,600 to $103,350
Discovered 3 weeks ago
ASIC IP design and verificationSystemVerilogUniversal Verification Methodology (UVM)VerilogPythonPerl

Full Job Posting

Role overview

Soft IP engineering intern in Qualcomm Canada’s Ottawa 2027 intern class.

Contribute to the design and verification of ASIC IP blocks and subsystems with experienced engineers.

The internship application may route candidates to multiple project-specific opportunities.

Responsibilities

  • Help deliver standards-compliant IP blocks for Ethernet, UALink, UEC, ESUN, CXL, and PCIe FPGA or ASIC projects.
  • Develop and document verification environments using SystemVerilog and UVM.
  • Develop and document designs using Verilog; develop and execute test cases against RTL.
  • Open and track bug reports through resolution.
  • Develop scripts to support the development process.

Minimum qualifications

  • Currently pursuing a bachelor’s degree in Electrical Engineering, Computer Engineering, Engineering Science, Computer Science, or a related field.
  • Experience with Python, Perl, TCL, and Unix/Linux shell scripting.
  • Experience with a source-code revisioning system such as SVN, CVS, or RCS.
  • Able to work independently on a project and collaboratively with the team.
  • At least one year of academic experience with programming languages such as C, C++, or Python.
  • Expected graduation date of November 2028 or later.
  • Available for the selected internship duration: May/June 2027 to August/September 2028 for 16 months, or May/June 2027 to May/June 2028 for 12 months.

Preferred qualifications

  • Digital logic or digital-design experience; Verilog/VHDL programming; relevant industry or internship experience; debugging tools; and understanding of ASIC/FPGA flows are preferred.
  • Communication, listening, attention to detail, analytical and problem-solving skills, and consistent high-quality work are preferred.

Internship program

  • Interns receive a project mentor, manager support, professional development workshops, social events, cross-functional speaker sessions, and access to the Qualcomm employee community.
  • The program describes competitive hourly pay, accrued vacation, and a housing stipend.

Pay information

  • The posted pay scale is $54,600 to $103,350 for the job code and location; the description does not specify a salary cadence.

Application process

  • Resumes are reviewed on an ongoing basis; advancing candidates may be asked to complete a timed HackerRank challenge.
  • The posting notes that an export license may be required for candidates with citizenship in certain countries and could affect start timing.

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