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Electrical CM Support Engineer - Operations Engineering Team

Nokia
IND
Full-time
Mid
Hybrid
Discovered 3 weeks ago

Full Job Posting

Qualifications

  • BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
  • Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
  • Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
  • Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
  • Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.

Responsibilities

  • Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
  • Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
  • Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
  • Conduct process characterization, Design of Experiments (DOE), and process capability studies.
  • Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
  • Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
  • Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
  • Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
  • Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
  • Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

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