Staff Hardware Systems Engineer, Watches

Responsibilities

• Drive end-to-end electrical architecture for space-constrained devices, leveraging advanced packaging technologies like System in Package (SIP) and rigid-flex to maximize density and minimize Z-height.
• Act as the technical linchpin, collaborating with mechanical, Radio Frequency (RF), sensors, and display teams to resolve physical layout collisions and foster architectural convergence.
• Lead data-driven trade-offs balancing size, performance, cost, and thermals to keep development moving while optimizing SoC integration for power and thermal efficiency.
• Guide New Technology Introductions (NTI) to integrate novel, market-differentiating hardware components into the final product design.
• Ensure design for manufacturability (DFM) by overseeing rapid prototyping and validation of early-stage systems, ensuring compact architectures can be reliably scaled for mass production.
• - Drive end-to-end electrical architecture for space-constrained devices, leveraging advanced packaging technologies like System in Package (SIP) and rigid-flex to maximize density and minimize Z-height. - Act as the technical linchpin, collaborating with mechanical, Radio Frequency (RF), sensors, and display teams to resolve physical layout collisions and foster architectural convergence. - Lead data-driven trade-offs balancing size, performance, cost, and thermals to keep development moving while optimizing SoC integration for power and thermal efficiency. - Guide New Technology Introductions (NTI) to integrate novel, market-differentiating hardware components into the final product design. - Ensure design for manufacturability (DFM) by overseeing rapid prototyping and validation of early-stage systems, ensuring compact architectures can be reliably scaled for mass production.

Minimum qualifications:

Preferred qualifications:

Qualifications

• Minimum qualifications: - Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, a related field, or equivalent practical experience. - 6 years of experience working in a consumer electronics technical environment. - 3 years of experience in technical leadership. Preferred qualifications: - 10 years of consumer electronics experience, specializing in HDI design, FPC, and rigid-flex assemblies. - Experience in advanced packaging (SiP, PoP, CoW) to drive system miniaturization. - Experience in lifecycle management from concept and NTI through EVT/DVT to mass production. - Experience in adjacent disciplines like RF, thermal, and mechanical engineering. - Ability to navigate ambiguity, evaluate complex data, and make sound technical risk assessments. - Exceptional communication skills, distilling complex technical trade-offs into actionable insights for cross-functional peers and leadership.