{bc}
Apply
company_site

Staff Hardware Engineer, TPU Interconnect and Packaging

Google
Sunnyvale, USA
Senior · 10+ years experience
Onsite
USD 192000-278000 / year
Discovered 1 weeks ago

Full Job Posting

Responsibilities

  • Define the architectural strategy and package technology selection for next-generation TPU systems, incorporating 2.5D/3D interposers, embedded bridges, and co-packaged optics (CPO) modules.
  • Drive electro-optical co-design across silicon photonics dies, laser sources, package substrates, and drive electronics to maximize interconnect bandwidth density and energy efficiency.
  • Establish signal integrity, power delivery, thermal management, and mechanical design rules across multi-chiplet heterogeneous assemblies.
  • Partner with outsourced semiconductor assembly and test (OSAT) vendors, foundries, and optical component suppliers to co-develop custom substrate processes, sub-micron alignment flows, and optical coupling interfaces.
  • Lead full-lifecycle technology qualification from pathfinding and architectural simulation through to mass production readiness, while mentoring engineers, fostering technical excellence, and driving engineering best practices across the organization.

Minimum qualifications:

  • Bachelor’s degree in Electrical Engineering, Materials Science, Optical Engineering, Microelectronics, a related technical field, or equivalent practical experience.
  • 10 years of experience in semiconductor packaging, integration, or interconnect design.
  • Experience with interconnect modeling, 2.5D/3D interposer design rules, or chiplet package assembly.

Preferred qualifications:

  • Master's degree or PhD in Electrical Engineering, Optical Science, Materials Science, or a related technical discipline.
  • Technical expertise in silicon photonics integration, Co-Packaged Optics (CPO), 2.5D silicon interposers, and high-density substrate routing.
  • Deep knowledge of wafer-level packaging (WLP), chiplet interconnect standards, dynamic thermal control, and high-density power delivery networks.
  • Demonstrated success in delivering first-of-a-kind optical packaging or heterogeneous 3D integration solutions into production systems.
  • Track record of leading complex package development programs for high-performance computing (HPC) or AI accelerator platforms.

Apply for this job in 1 click

Skip the repetitive application forms

Install the Base Career Chrome Extension and autofill job applications across major job boards with your profile.

Sarah M.James T.Maya R.

Trusted by over 500,000 job seekers on Base Career

Start Free Today

More from this employer

More jobs at Google

Sales Operations Senior Associate

New York City, USA

Discovered Today

Program Manager, Transformation, AI2

Kirkland, USA

Discovered Today

Customer Engineer III, Platform, Google Cloud

Austin, USA

Discovered Today

ASIC Power Engineer, ML Accelerators

Sunnyvale, USA

Discovered Today

Data Center Facilities Technician, Mechanical

Lenoir, USA

Discovered Today

ISV Sales Specialist III, Google Cloud

San Francisco, USA

Discovered Today

Platform Customer Engineer, Manufacturing and Conglomerates

Mumbai, IND

Discovered Today

Research Scientist, Robotics Data, Pretraining, DeepMind

, USA

Discovered Today