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Silicon Photonics Packaging Engineer Co-op

Nokia
USA
Full-time
Intern
Onsite
Discovered Today

Full Job Posting

Qualifications

  • Experience with package and process design/development from design to production.
  • Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
  • Experience with documentation of fabrication, inspection, and assembly processes.
  • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
  • It would be nice if you also had:
  • Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
  • Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
  • Experience in high-speed electronics package design and/or laser package design.
  • Experience with thermo-mechanical simulations using ANSYS or similar software.
  • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
  • Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

Responsibilities

  • We are searching for a Silicon Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.
  • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
  • Own Design Rules documents and ensure Design for Manufacturing specifications are met.
  • Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
  • Drive package debug activities during product validation and qualification.
  • Plan and Drive prototype assembly builds to enable deliveries for early design validation.
  • Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

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