Senior Technical Lead (US)

Job Summary

Key Responsibilities

• Precision Board-Level Rework & Micro-Soldering
• Perform high-density, high-precision manual soldering and de-soldering of surface-mount (SMT) and through-hole components under high-magnification stereo microscopes.
• Execute component replacement down to 0201/0402 passive package sizes, fine-pitch ICs, QFNs, high-density mezzanine/backplane connectors, and discrete semiconductors without damaging adjacent board features.
• Perform trace cuts, pad restorations, solder mask repairs, and precision jumper wire modifications (0.001" to 0.005" magnet/wire gauge) for ECO implementations and hardware bug fixes.
• Build, modify, and repair custom cable assemblies, wire harnesses, power leads, and test debug headers.
• Design Engineer Debug & Bring-Up Support
• Partner directly with electrical and diagnostic engineers to instrument prototype boards with probe wires, coaxial pigtails, and test points for oscilloscope/logic analyzer debug.
• Assist with rapid turnaround on bring-up reworks, thermal sensor attachments, and prototype validation builds.
• Inspect completed reworks using optical inspection tools to guarantee adherence to IPC-A-610 / IPC-7711/7721 Class 3 standards.
• Prototype Services & Lab Operations Support (As Time Permits)
• Support the prototype services team with complete mechanical chassis assembly and disassembly, including sheet metal, heatsinks, torque-specified fastener sequences, and fan/power supply module integration.
• Manage and maintain inventory tracking for rework station consumables (solder alloys, fluxes, tips, wire, specialized micro-tools, and common passive/connector components).
• Proactively monitor consumable stock levels and initiate purchase requisitions to prevent lab downtime.
• Maintain laboratory 5S standards, ESD-safe workstation compliance, and preventative maintenance for rework equipment (hot air stations, thermal tweezers, solder pots, and preheaters).
• Skill Requirements

Minimum Qualifications

• Experience: 5+ years of hands-on experience in high-density PCBA rework, micro-soldering, and electronics laboratory support within an R&D or NPI environment.
• Micro-Soldering Expertise: Demonstrated mastery of miniature SMD component rework down to 0203 package size under optical magnification.
• Schematic & Layout Literacy: Ability to read schematics, board assembly drawings, CAD layout viewers (Allegro/Cadence), and ECO markup instructions.
• Hand Tools & Measurement: Proficient with high-end soldering stations (Metcal, JBC, Hakko), hot-air rework tools, digital multimeters, microscopic inspection cameras, and torque drivers.
• Mechanical Aptitude: Hands-on skill with electronic chassis mechanics, modular subassemblies, and thermal interface materials.
• Soft Skills: Strong attention to detail, proactive communication, and ability to prioritize rework queues in a fast-paced hardware development cycle.
• Other Requirements
• 5+ years of hands-on experience in high-density PCBA rework, micro-soldering, and electronics laboratory support within an R&D or NPI environment.

Preferred Qualifications

• Active or prior certification in IPC-A-610, IPC-J-STD-001, and/or IPC-7711/7721 (Rework, Modification, and Repair of Electronic Assemblies).
• Experience working on complex high-layer-count (20+ layers) networking/security systems, optical modules, or high-speed digital boards.
• Experience with basic lab inventory management and procurement systems.