Senior Product Applications Engineer II

Role overview

Technical leadership and design

• Lead technical development of AI/HPC projects and establish reference architectures, best practices, and deployment governance.
• Design AI Pods, GPU clusters, NVIDIA HGX/MGX and NVL platforms, AI Factories, and high-density data-center environments.
• Guide liquid-cooling, hydraulic, thermal-management, heat-rejection, redundancy, and energy-efficiency design.
• Integrate rack architecture, containment, airflow, power distribution, 800VDC-ready infrastructure, and mechanical-electrical systems.

Presales, tendering, and engagement

• Enable sales, business development, presales, consultants, contractors, hyperscalers, and AI ecosystem partners.
• Lead specifications, design reviews, technology positioning, customer workshops, executive presentations, and design validation.
• Own technical tendering from qualification and architecture validation through risk assessment, value engineering, bid defense, negotiations, and award.
• Build customer and ecosystem relationships and represent the organization at workshops, conferences, seminars, and forums.

Experience and expertise

• Requires 12–15+ years in mission-critical data-center infrastructure and at least 7 years dedicated to high-density cooling technologies.
• Requires demonstrated AI/HPC project experience and expertise in liquid-cooling architecture and deployment.
• Requires extensive technical tendering and value-engineering experience and customer-facing work with hyperscalers, enterprises, EPCs, and consultants.
• Seeks a recognized technical authority able to mentor regional presales or engineering teams and drive technology adoption.

Technical domains

• AI infrastructure, GPU clusters, HPC architecture, AI Factory design, rack-density optimization, and AI-ready electrical infrastructure.
• Critical data-center systems include Tier III/IV architectures, white space, containment, precision cooling, chilled water, CRAH/CRAC, and in-row cooling.
• Liquid-cooling domains include Direct Liquid Cooling, immersion cooling, TCS/SFN, CDU technologies, heat exchangers, hydraulic systems, thermal modeling, and heat recovery.
• Electrical and compute infrastructure includes 800VDC technologies, high-density power trains, AI POD skids, and integrated compute infrastructure.

Industry ecosystem