{bc}
oracle

Principal Program Manager

Nokia
San Jose, USA
Full-time
Senior · 8+ years experience
Hybrid
USD 149000-213000 yearly / year
Discovered 3 days ago

Full Job Posting

Responsibilities

  • Key Responsibilities
  • Program Leadership
  • Lead end-to-end ASIC development programs from planning through production release while developing and maintaining integrated program schedules covering all major development milestones.
  • Establish clear ownership, accountability, and decision-making processes across functional teams and facilitate alignment and issue resolution in a timely manner.
  • Schedule and Milestone Management
  • Build and manage program plans for from architectural specifications to conclusion of validation and qualification of the ASIC project and track critical path tasks and cross-functional dependencies.
  • Monitor milestone progress, achievements and forecast program outcomes.
  • Risk and Issue Management
  • Lead risk identification, assessment, mitigation, and escalation activities to drive rapid resolution of technical, schedule, resource, and dependency issues.
  • Conduct regular program health reviews, track and drive all issues that arise to resolution.
  • Cross-Functional Coordination
  • Partner closely with ASIC project engineering leaders and all cross-functional teams to understand critical deliverables between all teams and timelines associated with development and release. Continuously monitor and track the deliverables and all issues that arise that could potentially cause delays.
  • Drive operational cadence: Executive Monthly Reviews, ASIC WW all hands, agenda/material prep, knowledge sharing, and action item closure
  • Continuous improvements: identify areas for improvement between HW, SDK, SW and other cross-functional teams, propose solutions and drive implementation
  • ASIC Resources: Support org structure, headcount planning, and hiring prioritization for engineering teams by working with hiring managers and staffing support teams
  • Project Milestone Management
  • As critical development milestones are approaching, ensure that all relevant checklists and reviews occur in advance of achieving the milestone event. Drive actions that arise from the checklists and reviews to closure so that tapeout occurs on or before the target date.
  • Process Improvement
  • Continuous process program management improvements leveraging AI, methodologies and reporting of development metrics will be essential to keep up with the tremendous challenges that are faced to achieve execution predictability and implementation of best practices associated with risk mitigation, cross functional alignment and overall ASIC and DSP development processes.

Qualifications

  • Required Qualifications
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related technical field.
  • 8+ years of semiconductor industry experience.
  • 5+ years of program or project management experience leading ASIC or SoC development programs.
  • Demonstrated experience delivering successful tapeouts from concept through production.
  • Strong understanding of ASIC development lifecycles and semiconductor product development processes.
  • Proven ability to manage complex, cross-functional engineering teams.
  • Preferred Qualifications
  • Master's degree in Engineering, Computer Science, or Business Administration.
  • PMP certification or equivalent program management certification.
  • Experience with advanced process nodes such as 3nm, 2nm and beyond
  • Experience managing external vendors, foundries, and IP suppliers.
  • Understanding of AI, networking, wireless, data center, or telecom ASIC products.
  • Program Management Skills:
  • Program planning
  • Critical path analysis
  • Risk management
  • Dependency management
  • Executive communication
  • Stakeholder management
  • Financial and resource planning
  • Escalation management
  • Data-driven decision making
  • Technical Knowledge:
  • ASIC/SoC development lifecycle
  • Digital and analog design methodologies
  • Design verification
  • DFT and test methodologies
  • Physical implementation flows
  • Timing closure
  • Power and performance optimization
  • Silicon validation
  • Product qualification
  • Semiconductor manufacturing processes
  • Leadership Competencies:
  • Strategic thinking
  • Relationship building
  • Technical judgment
  • Bias for action
  • Collaboration and influence
  • Clear communication
  • Problem solving
  • Ownership and accountability
  • Continuous improvement mindset

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