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indeed

Jr. Product Engineer

Semtech
Burlington, CAN
Full-time
Intern
Hybrid
$75,000–$84,000
Discovered 3 weeks ago
New product introduction (NPI)Semiconductor product engineeringDesign for Testability (DfT)Design for Manufacturability (DfM)Automated Test Equipment (ATE) test programsProduct characterization

Full Job Posting

Role overview

The Junior NPI Product Engineer supports new product development from early-stage work through production transfer, under the guidance of senior engineers.

The team develops high-performance optical and analog/mixed-signal semiconductor IC products using CMOS and BiCMOS technologies.

The role is hybrid in Burlington, Canada, with office attendance Monday through Thursday.

NPI and cross-functional support

  • Support NPI from concept through product release and transfer to full-volume manufacturing.
  • Collaborate with project, design, marketing, validation, test, characterization, quality, reliability, applications, and operations teams.
  • Track backend NPI progress, timelines, milestones, and program logistics; support milestone reviews.
  • Prepare production release deliverables and OSAT manufacturing documentation.

Test, characterization, and yield

  • Support DfT and DfM requirements, ATE test program development and optimization, product characterization, correlation, and release.
  • Help prepare datasheet specifications and production test limits; develop wafer-level and bench characterization plans.
  • Analyze ATE and bench results across process, voltage, and temperature variations; support yield modeling, DOE, yield analysis, and test optimization.
  • Support validation and reliability qualification and identify opportunities to reduce yield loss.

Manufacturing quality and improvement

  • Monitor yield and quality metrics and support review of test coverage, test limits, and guard banding.
  • Assist with failure analysis, root cause investigation, and corrective and preventive actions for field returns and RMA cases.
  • Work with foundry process and packaging teams to resolve issues during fabrication, packaging, die sort, and final package testing.
  • Contribute to lifecycle monitoring, cost reduction, and continuous improvement.

Minimum qualifications

  • Bachelor’s degree in Electrical Engineering or a related field; a master’s degree is a plus.
  • At least two years of semiconductor product, test, or design engineering experience; relevant internship or co-op experience is considered.
  • Basic familiarity with statistical theory and data analysis tools such as Excel or JMP.
  • Foundational knowledge of semiconductor physics and analog/mixed-signal IC design principles.
  • Strong analytical, problem-solving, and communication skills, and eagerness to learn.

Preferred exposure

  • Exposure to or coursework in DFM, DFT, and ATE test methods is a plus.
  • Familiarity with Advantest or Teradyne high-speed digital ATE platforms or bench test equipment is a plus.
  • Basic awareness of JEDEC, HTOL, ESD, latch-up, and semiconductor reliability qualification is a plus.

Pay

  • The estimated pay range is CAD $75,000–$84,000; the posting does not specify the pay period.

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