Hardware Technical Program Manager

Own the silicon schedule from architecture freeze through tapeout, bring-up, and production with the schedule informed by customer requirements and internal functional leads.

Drive the weekly execution cadence (program reviews, design reviews, tapeout readiness) and maintain a single source of truth for status, dependencies, and decisions.

Coordinate handoffs across architecture, RTL, DV/emulation, DFT, physical design, IP, package, and software

Manage the dependency chains hardware programs live and die on: IP delivery, PDK/library releases, EDA versions, and emulation capacity.

Run the tapeout checklist and signoff matrix (timing, power, IR/EM, DRC/LVS, DFT coverage, ECO closure, GDS handoff), holding owners to closure criteria.

Work with supply chain/logistics for: IP acquisition, silicon arrival, ATE/loadboard readiness, lab scheduling, bug triage, and ECO/respin decision support.

Surface risk early with mitigation options and schedule impact quantified — late IP, coverage shortfalls, convergence misses, foundry slot changes.

Facilitate PPA, schedule, and scope tradeoffs, and document what was decided, by whom, and why.

Interface with foundry, OSAT, IP, and EDA partners on deliverables, technology file releases, mask slots, and escalations; support export control/ECCN compliance with legal and operations.

Deliver crisp executive reporting — where the program stands, what's at risk, what decision is needed and by when — across distributed teams and time zones.

Track resource allocation and NRE/mask/license/prototype budgets against program needs.

Required Qualifications

B.S. in Electrical/Computer Engineering, Computer Science, or equivalent; M.S. or MBA a plus.

7+ years in semiconductor/hardware engineering or program management, including at least 2 full SoC/ASIC programs taken from concept through tapeout and silicon bring-up.

Working fluency in the chip design flow: RTL, functional verification and coverage closure, DFT, synthesis, PnR, STA, physical signoff (DRC/LVS/IR/EM), GDSII handoff, and post-silicon validation.

Demonstrated ability to build and defend a bottoms-up schedule with critical path analysis and dependency mapping.

Track record influencing without authority — earning the technical credibility to push senior engineers on commitments and dates.

Strong written and verbal communication; able to run a room of principal engineers and an exec review with equal effectiveness.

Hands-on with program tooling: Jira, Confluence, MS Project/Smartsheet, and familiarity with the Synopsys/Cadence/Siemens EDA ecosystem.

Desired Qualifications & Experience Requirements

Prior hands-on engineering experience in design, DV, or physical design before moving to program management.

Experience on advanced or FinFET nodes (16/12/7nm or more advanced) and direct foundry engagement (TSMC preferred).

Familiarity with AI/ML accelerators, dataflow or novel compute architectures..

Experience managing emulation/FPGA prototyping programs and pre-silicon software enablement timelines.

Exposure to package/board co-design programs (FC-BGA, WLCSP) and OSAT coordination.

Experience with EVK/reference board programs and customer/FAE enablement schedules.

Familiarity with quality and compliance frameworks relevant to the target market (automotive, industrial, or security certifications).

We offer a competitive salary for this role, generally ranging from $200,000 to $240,000, along with bonus, meaningful equity and comprehensive benefits. The final compensation package will be based on your experience and location, with some flexibility to ensure we align with the right candidate.

Why Join Efficient?

Efficient offers a competitive compensation and benefits package, including 401K match, company-paid benefits, equity program, paid parental leave, and flexibility. We are committed to personal and professional development and strive to grow together as people and as a company.