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Engrg Technician 3

Nokia
USA
Full-time
Mid
Onsite
Discovered 4 days ago

Full Job Posting

Qualifications

  • Familiarity with cleaving singulation, die-attach and wirebond assembly process related defects. Knowledge in identifying or addressing common causes of assembly defects is a plus. Experience with SPC and MES systems is a plus. Experience in III-V semiconductors is desired.

Preferred Qualifications

  • Familiarity with cleaving singulation, die-attach and wirebond assembly process related defects. Knowledge in identifying or addressing common causes of assembly defects is a plus. Experience with SPC and MES systems is a plus.
  • Experience in III-V semiconductors is desired.

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