Electromechanical Engineer (All-Levels)

Lead the mechanical and structural design of space-qualified electronics enclosures, ensuring survival under launch random vibration, acoustic loads, and shock environments

Select flight-proven materials, surface treatments, and staking compounds while balancing structural stiffness, thermal conductivity, electrical bonding, and outgassing limits

Produce flight drawing packages with precise GD&T, fastener torque schedules, and electrical grounding and bonding callouts per spaceflight standards

Collaborate closely with thermal analysis teams to verify conductive thermal paths from high-power die and board interfaces to chassis conduction decks and radiator interfaces in vacuum

Integrate passive and active thermal control hardware, including heat pipes, thermal straps, thermal interface materials, operational and survival heater circuits, RTDs, thermistors, and multi-layer insulation (MLI) blankets

Architect static and articulated or dynamic harness installations, including cable wrap mechanisms, service loops, twist capsules, and flex or rigid-flex jumper assemblies

Design custom brackets, harness support trays, strain relief features, and breakout bulkheads optimized for mass, mass-elastic constraints, and design for manufacturability (DFM)

Present and defend mechanical packaging, harness routing schemes, and thermal hardware implementations at formal milestone reviews, including PDR, CDR, TRR, and MRR

Bachelor’s degree in a science, technology, engineering or mathematics (STEM) related field

1+ years of experience designing and developing physical hardware for high-reliability applications

Experience using 3D CAD software such as Siemens NX, Creo, or SolidWorks, including mechanical packaging, sheet metal, and machined enclosures

Experience working with electrical harnesses, interconnects, wire routing, shielding, and grounding for complex hardware systems

Experience applying thermal management concepts, including heat sinks, thermal interface materials, heaters, and thermal paths for hardware operating in controlled or vacuum environments

Master’s degree in a science, technology, engineering or mathematics (STEM) related field

Experience designing or supporting flight-qualified hardware for satellites, launch vehicles, lunar landers, space robotics, or other aerospace systems

Experience using 3D harness routing or electrical routing tools, such as Capital Harness, Zuken E3, or NX Electrical Routing

Experience developing rigid-flex PCB physical layouts or continuous-flex interconnects for moving mechanisms, gimbals, or deployment systems

Experience working with spaceflight interconnect standards and requirements, including IPC/WHMA-A-620 Space Addendum and NASA-STD-8739.4

Experience designing or implementing MLI for vacuum environments

Experience performing bonding and grounding verification, including low-resistance or milli-ohm measurements

Experience designing or supporting vehicle harness bundles or avionics enclosures used in operational aerospace systems