Electromagnetics (EM) and Packaging Design Engineer
Key Skills for This Role
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About the Position
Kilby Labs is seeking a highly motivated and experienced electromagnetic modeling engineer to support various TI product development, including Silicon Photonics, RF filters and 2.5D/3D heterogeneously integrated systems. This role is responsible for the RF modeling of new technology platforms and product ideas. The role requires working extensively across other internal teams including advanced process technology development (ATD), packaging, chip design and test, and product engineering, to make innovative, high performance and cost-effective solutions. This position is ideal for individuals interested in RF design, electromagnetics, filter design, RFIC and module co-design, and advanced/heterogeneous packaging technologies. For this role we are seeking a creative problem-solver who can develop unique and breakthrough solutions.
Responsibilities may include, but are not limited to:
Drive and execute the strategy of high frequency and high-speed interconnect simulations for various product developments.
Lead the electromagnetic modeling needs of the team for various applications; such as advanced packages, TSVs, heterogeneously integrated 2.5D/3D systems.
Build and analyze electromagnetic models of RF passive structures, including: filters, matching networks, baluns, couplers, RF transitions and interconnects.
Perform electromagnetic simulations using tools such as HFSS and EMX
With extracted S-parameters, run circuit and system-level simulations.
Investigate RF interactions between the circuits, package structures, and passive components.
Drawing mask layouts for test structures for proof-of-concept studies, as well as supporting technology development activities
Evaluate design trade-offs related to performance, and manufacturability.
Qualifications
- Minimum Requirements:
- Master’s/Ph.D. degree in Electrical Engineering, Physics, Applied Physics, or Material Science.
- 3+ years of industry experience on EM design
- Understanding S-parameters and impedance matching
- Experience with semiconductor technologies (CMOS, BiCMOS, GaAs, InP, etc..) and basic understanding of standard back-end-of-line (BEOL) stack-ups
- Familiar to one or more of the following software packages: Ansys HFSS, Keysight ADS, EMX, Cadence Virtuoso
- Basic experience on layout drawing
- Basic experience of RF measurements
- Ability to work independently and lead cross-functional collaboration between process, fab, and design teams.
- Preferred Qualifications:
- Understanding of RF and microwave circuits, electromagnetic theory, analog and RF integrated circuit design
- Knowledge of RF Filter design
- Knowledge of microelectronic fabrication and advanced packaging technologies
- Knowledge of high-speed PCB design
- Strong verbal and written communication skills.
- Ideal candidates must also excel at promoting new ideas, building collaborative relationships, working across organizations.
Preferred Qualifications
- Understanding of RF and microwave circuits, electromagnetic theory, analog and RF integrated circuit design
- Knowledge of RF Filter design
- Knowledge of microelectronic fabrication and advanced packaging technologies
- Knowledge of high-speed PCB design
- Strong verbal and written communication skills.
- Ideal candidates must also excel at promoting new ideas, building collaborative relationships, working across organizations.
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