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"Principal Package Engineer" Jobs in United States

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Principal Package Engineer

Microsoft · Redmond

SeniorFull-timeOnsite

The principal package engineer will be responsible for providing expertise, insight, and support to the Silicon development team through the entire life cycle of the product. In this role, you will be responsible for sup

Discovered 1 weeks ago

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Principal Package Engineer

Delos Data ·

LeadFull-timeRemote

Who We Are We are a startup building foundational technology to address performance, scalability, and resiliency challenges in large‐scale AI data center clusters. We are backed by top‐tier VC firms and notable angel inv

Discovered 3 weeks ago

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Principal Package Design Engineer

Renesas Electronics · Tempe

SeniorFull-timeOnsite

Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging. P

Discovered 5 days ago

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Systems Engineer - Technical Data Package Delivery (Principal or Sr. Principal Engineer Level)

Northrop Grumman ·

LeadFull-time

RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible opportuni

Skills

sap

Discovered 1 weeks ago

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Systems Engineer - Technical Data Package Delivery (Principal or Sr. Principal Engineer Level)

Northrop Grumman · Melbourne

USD 98400-184200 yearly / yearSeniorFull-timeOnsite

RELOCATION ASSISTANCE: Relocation assistance may be available CLEARANCE REQUIRED FOR START: Yes CLEARANCE TYPE: Secret TRAVEL: Yes, 10% of the Time Description At Northrop Grumman, our employees have incredible oppo

Skills

TeamcenterNX

Discovered 1 weeks ago

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Principal Package Design Engineer

Renesas Electronics · San Jose

USD 195000-240000 yearly / yearSeniorFull-timeOnsite

Job Description We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role w

Discovered 3 weeks ago

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