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Sr. Packaging Engineer (Semiconductor)

Semtech Ā· Hyderabad

SeniorFull-timeOnsite

Responsibilities: Ā· Lead Advanced Package Development: Define, develop, and qualify advanced package architectures (WLCSP, DFN, QFN, flip-chip, multi-die) for TVS, TDS, and Hot Switch protection products, ensuring electr

Discovered 3 weeks ago

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