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Staff Failure Analysis Engineer

Renesas Electronics
Palm Bay, USA
Full-time
Senior · 8+ years experience
Onsite
Discovered Yesterday
Communication

Full Job Posting

Preferred Qualifications

  • Advanced physical analysis experience utilizing Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS/EDX), or Focused Ion Beam (FIB).
  • Experience with analog, power management, or mixed-signal IC architectures.
  • Familiarity with industry quality standards (AEC-Q100, JEDEC) and formal problem-solving methodologies (8D, 5 Whys).
  • Strong communication skills with the ability to articulate complex technical failure mechanisms to both engineering teams and non-technical stakeholders.
  • Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‐leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
  • At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
  • We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
  • Are you ready to join our team and shape the future with us?
  • Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
  • Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Qualifications

  • Experience & Education: Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with a minimum of 8 years of related experience; Or a Master’s degree with 6 years of related experience; Or a PhD with 3 years of related experience;
  • Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field with a minimum of 8 years of related experience;
  • Or a Master’s degree with 6 years of related experience;
  • Or a PhD with 3 years of related experience;
  • Fabrication & Packaging Knowledge: Strong fundamental understanding of front-end semiconductor fabrication processes (CMOS, BCD, or analog/mixed-signal) and modern IC packaging technologies.
  • Bench & Test Competency: Demonstrated proficiency in using standard bench test equipment (oscilloscopes, SMUs, power supplies, multimeters) to power up devices and characterize electrical fault symptoms.
  • Schematic & Layout Literacy: Proven ability to read and interpret electrical circuit schematics, netlists, and physical layouts (e.g., Cadence Virtuoso, GDS viewers) to trace electrical paths to physical silicon coordinates.
  • Analytical Techniques & Instrumentation: Direct hands-on experience across traditional failure analysis workflows: Package & Non-Destructive: Curve tracing, X-ray, and Scanning Acoustic Microscopy (SAM). Image-Based Fault Isolation: Photon Emission Microscopy (PEM/EMMI), OBIRCh, and thermal emission. Deprocessing Techniques: Wet chemistry/decap, mechanical polishing/lapping, and plasma etching.
  • Package & Non-Destructive: Curve tracing, X-ray, and Scanning Acoustic Microscopy (SAM).
  • Image-Based Fault Isolation: Photon Emission Microscopy (PEM/EMMI), OBIRCh, and thermal emission.
  • Deprocessing Techniques: Wet chemistry/decap, mechanical polishing/lapping, and plasma etching.

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