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oracle

Staff Dry Etch Process Engineer

Nokia
USA
Full-time
Senior · 5+ years experience
Hybrid
Discovered 5 days ago

Full Job Posting

Qualifications

  • M.S. or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, Mechanical Engineering, or a related technical field.
  • B.S. degree with 5+ years of semiconductor, photonics, or optoelectronic process engineering experience will also be considered.
  • Experience in semiconductor or photonic process development, integration, or sustaining engineering.
  • Strong understanding of plasma etch fundamentals, chamber hardware, process characterization, and defect reduction methodologies.
  • Experience with DOE planning, statistical analysis, SPC, and process capability improvement.
  • Ability to work effectively across multidisciplinary engineering and manufacturing organizations.
  • Strong ownership mindset with a demonstrated ability to independently drive projects, solve problems, and deliver results.
  • Ability to prioritize and respond quickly to manufacturing challenges in a dynamic environment.

Preferred Qualifications

  • Hands-on experience with ICP, RIE, or other advanced dry etch systems used in compound semiconductor or photonic device manufacturing.
  • Experience processing InP, GaAs, SiN, silicon photonics, or other III-V semiconductor technologies.
  • Understanding of photonic device fabrication challenges, including waveguide profile control, etch depth uniformity, optical loss reduction, and dimensional variation control.
  • Experience with optical metrology, SEM analysis, cross-section characterization, and defect inspection techniques.
  • Knowledge of photonic integrated circuit fabrication, including lasers, modulators, optical amplifiers, and passive optical components.
  • Experience supporting technology transfer, yield improvement, and high-volume manufacturing environments.
  • Experience collaborating with equipment suppliers and external technology partners on process development initiatives.

Responsibilities

  • Develop, qualify, and sustain dry etch processes for InP photonic integrated circuits and related optical devices.
  • Optimize critical process metrics including etch rate, CD control, sidewall profile, selectivity, surface morphology, roughness, uniformity, and device performance.
  • Support fabrication of optical structures such as waveguides, SOAs, lasers, modulators, and passive optical components.
  • Drive defect reduction, yield improvement, and process capability enhancement using DOE, SPC, statistical analysis, and advanced process control methodologies.
  • Perform root-cause analysis and corrective actions for process excursions, equipment issues, yield losses, and device performance gaps.
  • Analyze processes from a first-principles, physics-based approach to understand and manipulate mechanisms, not just recipes
  • Collaborate with lithography, wet etch, thin film, metallization, reliability, and device engineering teams to develop integrated process flows.
  • Partner with equipment and materials suppliers on chamber matching, hardware upgrades, process optimization, and cost-of-ownership improvements.
  • Document process baselines, engineering evaluations, change controls, and best practices; communicate results to cross-functional teams and management.
  • Support technology transfer from development into manufacturing while maintaining process stability and product quality.
  • Support a 24x7 manufacturing operation through participation in on-call support, issue escalation, and cross-functional problem-solving when required.
  • Demonstrates flexibility in work schedule and is willing to work swing shifts based on business requirements.
  • Leverage AI, machine learning, and advanced data analytics tools to improve process efficiency, yield, and engineering productivity.

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