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Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX
Austin, USA
Senior · 5+ years experience
Onsite
Discovered Today

Full Job Posting

RESPONSIBILITIES:

  • Own and drive advanced package selection, new product BGA configuration and package structure
  • Responsible for package/SIP layout, optimization, design verification and tapeout
  • Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design
  • Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
  • Simulate and optimize signal/power integrity and RF performance of the package design
  • Drive methodology, innovations, and productivity improvements in package design

BASIC QUALIFICATIONS:

  • Bachelor's degree in electrical engineering, computer engineering, or physics
  • 5+ years of experience with IC package design
  • Ability to work extended hours or weekends as needed to meet mission critical deadlines
  • To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
  • SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
  • Applicants wishing to view a copy of SpaceX’s Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to [email protected].

PREFERRED SKILLS AND EXPERIENCE:

  • Experience with Co-packaged Optics (CPO)
  • Thorough understanding of signal and power integrity fundamentals
  • Substrate design experience for RF, digital, high-speed and mixed signal die
  • Experience with Cadence APD+/SIP or similar design tools
  • Experience in package design electrical review, SI/PI analysis
  • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
  • Experience in package design for manufacturing reviews
  • Familiar with BGA package substrate technologies
  • Strong problem solving skills with strong engineering fundamentals

ADDITIONAL REQUIREMENTS:

  • ITAR REQUIREMENTS:

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