Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

Define the physical limits of what a chip can do, then break them!

NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale.

As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it.

You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely.

The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics.

The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely.

If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens.

What you'll be doing:

Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do.

Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards.

Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting and the trade-offs each choice entails across the full system.

System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.

What we need to see:

BS/MS/PhD in EE, Physics, or CE (or equivalent experience).

12+ years relevant experience

Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems

Proven ability to convert physical-limit trends into impact, measures and solutions

Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations

Ways to stand out from the crowd:

Exceptional work ethic and up-leveling discussions to solve the real problems

Native use of AI to accelerate build exploration and problem-space modeling

Experience solving problems spanning electrical, thermal, mechanical, and manufacturing domains simultaneously

Our team is at the forefront of silicon innovation, advancing groundbreaking technologies.

We offer a dynamic work environment where your contributions will directly impact the company's success.

Join us to advance your career in a role where you can truly make a difference.

With competitive salaries and a generous benefits package, we are widely considered one of the technology industry’s most desirable employers.

We have some of the most forward-thinking and hardworking people in the world working for us, and due to unprecedented growth, our exclusive engineering teams are rapidly growing.

If you're a creative and autonomous engineer with a real passion for technology, we want to hear from you!

#LI-Hybrid

You will also be eligible for equity and benefits.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.