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Senior Staff Engineer, Thermal Simulation

Samsung Semiconductor
San Jose, USA
Senior · 10+ years experience
Onsite
$189,000—$301,000 USD
Discovered 3 weeks ago

Full Job Posting

What You Bring

  • PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.
  • Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations.
  • Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
  • Fundamental understanding of IC chip/package architectures and thermal design constraints.
  • Working experience in SiP (System in Package) thermal analysis.
  • Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
  • You’re inclusive, adapting your style to the situation and diverse global norms of our people.
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
  • Innovative and creative, you proactively explore new ideas and adapt quickly to change.
  • #LI-MD1
  • What We Offer The pay range below is for all roles at this level across all US locations and functions. Pay within this range varies by work location and may also depend on job-related knowledge, skills, and experience. We also offer incentive opportunities that reward employees based on individual and company performance. This is in addition to our diverse package of benefits centered around the wellbeing of our employees and their loved ones. In addition to the usual Medical/Dental/Vision/401k, our inclusive rewards plan empowers our people to care for their whole selves. An investment in your future is an investment in ours.
  • Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community. Enjoy Time Away You’ll start with 4+ weeks of paid time off a year, plus holidays and sick leave, to rest and recharge. Care for Family Whatever family means to you, we want to support you along the way—including a stipend for fertility care or adoption, medical travel support, and virtual vet care for your fur babies. Prioritize Emotional Wellness With on-demand apps and free confidential therapy sessions, you’ll have support no matter where you are. Stay Fit Eating well and being active are important parts of a healthy life. Our onsite Café and gym, plus virtual classes, make it easier. Embrace Flexibility Benefits are best when you have the space to use them. That’s why we facilitate a flexible environment so you can find the right balance for you.
  • Base Pay Range$189,000—$301,000 USD
  • Equal Opportunity Employment Policy
  • Samsung Semiconductor takes pride in being an equal opportunity workplace dedicated to fostering an environment where all individuals feel valued and empowered to excel, regardless of race, religion, color, age, disability, sex, gender identity, sexual orientation, ancestry, genetic information, marital status, national origin, political affiliation, or veteran status.
  • When selecting team members, we prioritize talent and qualities such as humility, kindness, and dedication. We extend comprehensive accommodations throughout our recruiting processes for candidates with disabilities, long-term conditions, neurodivergent individuals, or those requiring pregnancy-related support. All candidates scheduled for an interview will receive guidance on requesting accommodations.
  • Our Commitment to Innovation and Fairness
  • At Samsung Semiconductor, we use Artificial Intelligence (AI) tools in the recruitment process to enhance efficiency. However, AI is used as a support tool, not a final decision-maker. All hiring decisions are made by our human recruiting team and hiring managers to ensure every candidate is evaluated fairly and holistically.
  • Recruiting Agency Policy
  • We do not accept unsolicited resumes. Only authorized recruitment agencies that have a current and valid agreement with Samsung Semiconductor, Inc. are permitted to submit resumes for any job openings.
  • Applicant AI Use Policy
  • At Samsung Semiconductor, we support innovation and technology. However, to ensure a fair and authentic assessment, we ask that candidates rely on their own knowledge and skills throughout the process. AI tools may be used for basic preparation, grammar, and research, but should not be used to generate or assist with submitted content or live interview responses. If we determine that AI is being used outside these guidelines, we reserve the right to pause or end the interview, and your candidacy may be disqualified.
  • Trade Secret Notice
  • By submitting an application, you agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.
  • Applicant Privacy Policy https://semiconductor.samsung.com/about-us/careers/us/privacy/

Qualifications

  • Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations.
  • Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.
  • Fundamental understanding of IC chip/package architectures and thermal design constraints.
  • Working experience in SiP (System in Package) thermal analysis.
  • Excellent communication and collaboration skills with demonstrated ability to work effectively in cross functional and cross cultural teams.
  • You’re inclusive, adapting your style to the situation and diverse global norms of our people.
  • An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
  • You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
  • Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Preferred Qualifications

  • PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.

Responsibilities

  • Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.
  • Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.
  • Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.
  • Analyze simulation and measurement results to enhance product reliability.
  • Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.
  • Translate customer requirements and thermal specifications into simulation methodologies.
  • Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.
  • Communicate technical findings clearly through engineering reports, presentations and customer reviews.
  • Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.

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