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Senior Scientist, Advanced Packaging

Qnity Electronics
Marlborough, USA
Full-time
Senior
Onsite
Discovered 4 days ago

Full Job Posting

Key Responsibilities

  • Lead research and development of advanced copper electroplating chemistries for dual damascene semiconductor interconnect fabrication.
  • Design and execute experiments to optimize Cu fill performance in high aspect ratio trenches and vias.
  • Partner with Material Innovation team to develop novel additive systems including suppressors, accelerators, levelers, and related formulation components.
  • Investigate plating mechanisms using electrochemical, analytical, and materials characterization techniques.
  • Collaborate with process integration, analytical, engineering, and manufacturing teams to accelerate technology development.
  • Support scale-up activities from laboratory development through pilot manufacturing and customer qualification.
  • Work directly with leading semiconductor customers to understand technology challenges and translate requirements into product roadmaps.
  • Drive technical programs through collaboration with global teams, including scientists and engineers, customer-facing account teams, and external partners.
  • Drive intellectual property generation through invention disclosures, patents, and technical publications.
  • Present technical results to customers, senior management, and industry conferences.
  • Monitor industry trends in advanced semiconductor metallization, interconnect scaling, and next-generation packaging technologies.

Required Qualifications

  • Ph.D. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical discipline.
  • Strong understanding of electrochemistry and metal electrodeposition principles.
  • Experience designing and analyzing statistically driven experiments.
  • Proven record of technical innovation and problem solving.
  • Excellent communication and presentation skills.
  • Ability to work effectively in a multidisciplinary and customer-facing environment.

Preferred Qualifications

  • Direct experience with electroplating for semiconductor applications.
  • Knowledge of dual damascene integration and BEOL metallization processes.
  • Familiarity with electrochemical methods including cyclic voltammetry, EIS, chronoamperometry, and chronopotentiometry at a rotating disk electrode.
  • Understanding of reliability challenges including electromigration, stress migration, and void formation.
  • Experience transferring R&D technologies into manufacturing environments.
  • Track record of patents, technical publications, and customer-facing technology development.
  • #LI-LH1
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  • Join our Talent Community to stay connected with us!
  • Qnity is an equal opportunity employer. Qualified applicants will be considered without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability or any other protected class. If you need a reasonable accommodation to search or apply for a position, please visit our Accessibility Page for Contact Information.
  • Qnity offers a comprehensive pay and benefits package. To learn more visit the Compensation and Benefits page.
  • We use Artificial Intelligence (AI) to enhance our recruitment process.

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