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Senior Integrated Photonics Packaging Engineer (RF) (m/f/d)

Q.ANT
Stuttgart, USA
Senior · 5+ years experience
Discovered 4 weeks ago

Full Job Posting

Your mission

Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)

Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation

Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques

Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)

Execute thermal management strategies for high-power photonic and high-frequency devices

Establish quality assurance and verification protocols to achieve ≥95% first-pass qualification on supplier-delivered modules

Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP

Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Your profile

  • M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered
  • 5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies
  • Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation
  • Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding
  • Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)
  • Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC)
  • Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills
  • Fluent in English; knowledge of German or another European language is a plus

Why us?

Work on the leading edge: Shape deep-tech evolution by developing novel high frequency packaging architectures that push the physical boundaries of AI computing.

Make impact at scale: Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market.

Broad decision-making authority: Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies.

Fast-track your growth: Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP.

World-class team: Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems.

Direct access to leadership: Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry.

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