Senior Director, Package Design Engineering

Qualifications

• Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or a related technical discipline.
• 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or a closely related field.
• Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
• Strong understanding of semiconductor product development process, package and assembly processes.
• Experience in Power Management products, particularly power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management system, PMICs, wafer-level and/or flip-chip technologies.
• Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.
• Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.
• Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.
• Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.
• Strong interpersonal, communication, negotiation, and executive presentation skills.
• Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.
• Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.
• Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.
• Experience supporting high-growth customer programs.
• Experience with Smart Power Stage, Vertical Power Stage, power module, discrete FET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.
• Experience with formal technical program management methodologies and portfolio-level governance.
• Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.
• On-time achievement of NPI milestones and customer commitments.
• Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.
• Timely closure of critical cross-functional task-force actions.
• Improved qualification, yield, reliability, and production-readiness performance.
• Effective execution and alignment of strategic OSAT/CM partners.
• Development of a high-performing global TPM organization and standardized program-management operating model.