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Principal Signal Integrity Engineer, Pathfinding

Micron Technology
Boise, USA
Full-time
Onsite
USD 119000-320000 yearly
Discovered 4 weeks ago
Signal integrity analysisPower integrity analysisElectromagnetic theoryTransmission line theoryTime- and frequency-domain simulationADS

Full Job Posting

Role overview

Principal technical contributor on Micron’s small Interface Pathfinding team.

Investigates energy-efficient bandwidth solutions for high-speed memory and die-to-die interfaces on a 3–5 year technology horizon.

The work uses original analysis, hands-on measurement, and rigorous validation to prepare innovations for product adoption.

Signal integrity work

  • Generate and validate electrical models for packages, substrates, and interconnects using field solvers and circuit simulation.
  • Evaluate forward-looking substrate and packaging technologies and their signal-integrity implications.
  • Analyze feasibility and drive I/O and channel co-optimization.
  • Develop package- and system-level design rules based on electromagnetic analysis.
  • Define link budgets and methods correlating simulations with measured silicon results.
  • Work across signal integrity, circuit and chip design, packaging R&D, and system integration.
  • Write analysis reports, modeling methodology documents, and design-rule specifications.

Required qualifications

  • MS or PhD in Electrical Engineering or related field; MS candidates need strong electromagnetic and SI fundamentals. PhD is preferred, not sufficient without practical capability.
  • 10+ years of signal or power integrity analysis for high-speed interface technologies.
  • Extensive electromagnetic and transmission-line theory applied to differential and single-ended interfaces.
  • Extensive time- and frequency-domain simulation experience; ADS, HSPICE, SPECTRE, or equivalent.
  • Deep electromagnetic field-solver experience, including setup, mesh strategy, and validation; Q3D, SIWAVE, HFSS, or equivalent.
  • Working knowledge of oscilloscopes, TDR, and VNA.
  • Able to own work, collaborate across disciplines, and make consequential analytical decisions.
  • Strong written and verbal communication for technical reports and specifications.

Preferred qualifications

  • Familiarity with memory I/O architectures and signal-integrity constraints.
  • Advanced packaging experience, including 2.5D/3D integration, embedded die, or high-density organic substrates.
  • Post-silicon characterization correlating simulation with measured TDR, insertion loss, eye diagrams, or BER.
  • Some familiarity with optical-link modeling.
  • Willingness to learn and apply AI-based methods to modeling and simulation workflows.
  • Pathfinding or advanced development experience where analysis methods are developed.

Compensation

  • Estimated US base salary is $119,000–$320,000 per year.
  • Additional compensation may include benefits, bonuses, and equity; stated salary range reflects base pay.

Benefits

  • Benefits include medical, dental, vision, income protection, paid family leave, paid time off, and paid holidays.

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