Principal Product Engineer

The position will have responsibility for product/test engineering for new product development and manufacturing. The position requires someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging. Drive pre-Si readiness for power, performance, Thermal and Power delivery (LDOs, Integrated VRs) related tests and features for successful bring up during power on. Drive Power and Performance tuning during post-Si phase in partnership with platform teams. Drive ATE test program implementation to optimize for SOC power/TDP. Work closely with platform/system engineers to drive necessary correlation work to enable such optimizations. Drive product manufacturing fuse requirements and end to end data flow for fusing across various test sockets. Successful candidates should have strong project leadership skills to manage external vendors, drive cross functional teams and drive sub-projects as part of larger development programs. They should also have excellent knowledge of ATE test program development including test method development, test bring-up, characterization, debug, and yield analysis. The candidate should also have knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory. The candidate would benefit from a background in various product market areas such as high-performance computing, AI, GPUs, CPUs. Overall product engineering role taking product from definition to launch. Adaptability (responds, explores, constructive attitude) Growth Mindset (It starts with a belief that everyone can grow and develop) Customer Focus (anticipates needs and proactively meets expectations) Drive for results (actively pursues outcome, delivers on commitments) Influence for impact (communicates, networks, persuades, influences) Judgement (scope problem, builds & applies knowledge) Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience. 8+ years of experience in Product development and manufacturing in large scale and/or high performance (i.e., AI, machine leaning, neural nets, CPU's) and/or high power SoCs/chips. 8+ years of experience in Developing Integrated Circuits (pre-silicon, first silicon bring-up, new product introduction). 5+ years of experience in product and test engineering, ATE test program development and debug (Advantest V93K experience is a plus) Excellent presentation and communication skills, with the ability to influence, engage, and communicate effectively with stakeholders at all levels.

in: Leading cross functional teams and understanding program/project management.

Managing supply chain, vendors / partners, and Integrated Circuit production.

in system/customer requirements gathering and interfacing. Si configuration (SKU) management and internal supplier/customer interfacing End-to-end product development flow and driving sample delivery milestones across the life cycle (Quality & Quantity) Knowledgeable in power / performance modelling for ATE binning optimization in both pre- and post-silicon phases of the program. In-depth understanding of ATE test program power/performance binning implementation including required characterization data collection. Knowledgeable in yield recovery definition (redundancy and repair for logic, array, analog) and their implementation (test programs, test content, SKU). Drive implementation partnering with cross-functional teams. System and Platform validation background is a plus.

working across various platforms (ATE/RVP/Customer boards) for product validation and characterization.

with failure analysis, qualification, and yield analysis