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Principal Packaging Engineer

Semtech
Ottawa, CAN
Full-time
Senior · 8+ years experience
Onsite
Discovered 1 months ago
Communication

Full Job Posting

Responsibilities

  • Design high-speed IC packages and Chip-On-Board (COB) solutions to meet new product technical and financial requirements; develop robust solutions that achieve the highest levels of quality and reliability in fast-paced Datacenter connectivity environments.
  • Perform 3D signal integrity modeling at silicon, package, and system levels, including experimental validation via Scattering Parameter (S-parameter) and Time-Domain Reflectometer (TDR) measurements where required.
  • Prepare technical reports and application notes for internal teams and external customers/suppliers, covering Signal and Power Integrity (SI/PI), PCB layout guidance, and assembly process instructions.
  • Design and produce PCB and high-density substrate layouts for reliability qualification and electrical performance evaluation.
  • Serve as technical interface with manufacturing suppliers throughout new product introduction (NPI), package definition, and design phases; drive alignment between design intent and manufacturing capability.
  • Identify, evaluate, and launch projects with new strategic suppliers and emerging package technologies to advance Semtech's packaging roadmap.
  • Mentor junior packaging engineers and contribute to continuous improvement of design methodologies, tools, and workflows.
  • Minimum Qualifications
  • Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
  • Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity — including crosstalk, impedance control, and return-loss optimization.
  • Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
  • Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
  • Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
  • Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
  • Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
  • Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
  • Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.

Desired Qualifications

  • Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
  • Experience with opto-electronic package assembly and photonic integration is highly desirable.
  • Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
  • Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
  • Experience working in a fabless semiconductor environment with global contract manufacturing partners.
  • Career Growth Philosophy
  • At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel — both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.
  • The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
  • All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
  • We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.
  • We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.
  • A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

Qualifications

  • Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field, with 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer.
  • Deep expertise in high-speed transmission line theory, multi-domain power delivery network (PDN) design, and package-level signal integrity — including crosstalk, impedance control, and return-loss optimization.
  • Hands-on proficiency with industry-standard EDA tools: Keysight Advanced Design System (ADS), Cadence Advanced Package Designer (APD/SiP), and Ansys HFSS.
  • Demonstrated experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
  • Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out (FOCOS), high-density substrate, silicon bridge interconnects, and Chip-On-Board (COB).
  • Experience in optoelectronics package design or opto-electronic assembly is a strong asset.
  • Working knowledge of JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) and its design implications.
  • Proven ability to manage supplier relationships and drive technical alignment throughout NPI and package qualification phases.
  • Strong written and verbal communication skills, with the ability to produce high-quality technical documentation for both internal and customer-facing audiences.
  • Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.
  • Experience with opto-electronic package assembly and photonic integration is highly desirable.
  • Background in Datacenter or high-speed communications product development (400G, 800G, 1.6T).
  • Familiarity with thermo-mechanical simulation tools and reliability engineering methodologies (e.g., finite element analysis for package stress modeling).
  • Experience working in a fabless semiconductor environment with global contract manufacturing partners.
  • Career Growth Philosophy
  • At Semtech, we seek innovation and leadership from each and every member of our team. Our goal is to ensure that our talented professionals are equipped with the support, resources, and opportunities they need to excel — both technically and professionally. Our pay-for-performance philosophy provides recognition and prestige coupled with a competitive compensation and benefits package, including equity participation. We invest in your growth because your success is our success.
  • The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.
  • All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.
  • We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace.
  • We may leverage Artificial Intelligence (AI) tools to enhance efficiency during candidate screening, assessment, and recruitment. Final hiring decisions remain with our Hiring Teams, not AI systems.
  • A reasonable estimate of the pay range for this position is $150,000 - $164,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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