Principal Package Design Engineer

MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.

5+ years of experience in semiconductor packaging or advanced electronics packaging.

Strong knowledge of advanced packaging technologies, materials, and assembly processes.

Experience with package reliability testing and qualification standards.

Deep understanding of thermal, mechanical, and electrical interactions in package design.

Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.

Ability to troubleshoot packaging failures and drive root cause/corrective action.

Strong project leadership and cross-functional communication skills.

Master’s or PhD in a relevant engineering discipline.

Experience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETS, Power Modules, Intelligent Power modules and their applications in consumer and industrial, automotive, performance computing.computing, AI/ML hardware or mobile products.

Hands-on experience with tools for package design and simulation such as: Cadence Allegro Package Designer Solid works ANSYS COMSOL JMP / Minitab

Cadence Allegro Package Designer

Solid works

ANSYS

COMSOL

JMP / Minitab

Knowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.

Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.

Company Description

At Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect.

Additional Information

The base salary range $195,000 - $240,000 represents the good faith estimate of the hourly wage or salary range that the company reasonably expects to pay for this position at the time of hire. Actual compensation decisions are based on a variety of factors, including but not limited to geographic location, relevant experience, skillset, and internal equity. Additional bonus opportunities are available for this role.

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.