oracle
Packaging Engineer
Texas Instruments
Dallas, USA
Mid · 5+ years experience
Onsite
Discovered 2 weeks ago
Full Job Posting
Qualifications
- Minimum requirements:
- Bachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering or related Engineering field of study
- 5+ years of experience working as an Engineer on projects with substantial packaging activities
Preferred qualifications:
- Ability to perform packaging tradeoffs between system performance, package design, cost, manufacturability, and reliability
- Ability to design packages with emphasis on power efficiency
- Understanding of inductor design and manufacturing
- Ability to work with assembly sites to ramp new processes
- Understand of manufacturing impact on quality
- Understanding of best practice to ensure supplier quality
About Texas Instruments
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