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OPC Technology Transfer Engineer (R&D)

Texas Instruments
Dallas, USA
Mid · 5+ years experience
Onsite
Discovered 3 days ago
Communication

Full Job Posting

Qualifications

  • Minimum requirements:
  • Masters in Electrical Engineering, Physics, Computer Science, Chemistry or related degree
  • 5+ years experience in a semiconductor photolithography and/or OPC development
  • Lithography & RET expertise for 45nm, 28nm, 22nm or 20nm processing nodes
  • Hands-on experience handling high-volume SEM measurement data and image inspections
  • Strong layout review skills using OPC verification tools to determine and isolate critical metrology targets
  • Profound understanding of OPC development flows, process window optimization, and design rule constraints

Preferred qualifications:

  • Strong knowledge/understanding of advanced lithography processes, lithography simulation techniques, mask making and RET techniques used in semiconductor manufacturing and process development
  • Demonstrated leadership skills with the ability to influence cross-functional teams and effectively communicate technical requirements to manufacturing staff on the Fab floor
  • Familiarity with physical layout (gds/oas). Knowledge of litho/OPC test pattern design and layout execution using test pattern generators and use of layout software like Virtuoso, KLayout
  • Programming experience in Unix environment
  • Understanding of OPC pattern validation methodologies and process window assessment techniques like KLA’s Photolithography Wafer Qualification (PWQ)
  • Demonstrated strong analytical and problem solving skills
  • Strong verbal and written communication skills
  • Ability to work in teams and collaborate effectively with people in different functions
  • Strong time management skills that enable on-time project delivery
  • Demonstrated ability to build strong, influential relationships
  • Ability to work effectively in a fast-paced and rapidly changing environment
  • Ability to take the initiative and drive for results

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