oracle
Mechanical Engineer Student
Nokia
CAN
Full-time
Mid
Onsite
Discovered 1 weeks ago
Full Job Posting
Qualifications
- You're a great fit if you have:
- Experience with optical transceiver packaging (e.g., QSFP, OSFP) and ASIC packaging.
- Knowledge of compliance, shock, and vibration testing for telecommunications applications.
- Familiarity with advanced substrate technologies (e.g., organic build-up, LTCC, HTCC, and high-performance PCB laminates).
- Basic knowledge of thermal modeling, FEA, and CAD design tools.
Responsibilities
- Support the mechanical design of optical pluggable modules.
- Review CAD models, detailed drawings, and conduct tolerance and stress analyses.
- Perform thermal and mechanical design verification testing (DVT) and assemble prototypes.
- Support the transition of designs to production with minimal redesign.
- Interface with suppliers/contract manufacturers to resolve integration issues.
- Author Engineering Change Orders (ECOs) and Bills of Materials (BOMs).
- Define and validate labeling, packaging, and regulatory compliance requirements.
- Partner with electrical, optical, manufacturing, and test teams to propose innovative solutions that improve product performance, cost, and reliability.
- Assist with root-cause analysis of field issues and support ongoing engineering efforts.
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