Manufacturing Operations Technical Programme Manager – Silicon and Packaging

Fractile is building silicon, systems and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost.

We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale.

Reporting into the Director of Programmes, the Manufacturing Operations Technical Programme Manager will manage the silicon production, packaging design, packaging manufacturing, and delivery flow through to our contract manufacturer.

This role will act as the key interface between Fractile, the foundry, OSAT partner and the internal operations team, ensuring that technical milestones, schedules, risks, and handoffs are tightly managed from wafer production through to packaged silicon delivery.

Own the end-to-end project plan from wafer production through packaged silicon delivery

Coordinate day-to-day activity with foundry, OSAT, packaging, logistics, and contract manufacturing partners.

Track milestones across wafer starts, fab progress, packaging, assembly, final test, qualification, and shipment.

Manage risks, dependencies, schedule changes, and timely issue resolution, working closely with team leads and programme managers for silicon, hardware systems and hardware test internally and external partners and suppliers

Ensure manufacturing documentation, test requirements, quality requirements, and build readiness materials are complete

Support NPI, prototype builds, qualification, and production ramp

Lead manufacturing operations programme reviews that surface risk early and clearly and contribute to overall programme portfolio reviews

Contribute to the design and rollout of scalable programme management practices across Fractile, covering planning, forecasting, reporting, risk and change control

Bring proven patterns from previous environments and adapt them to our development stage, pace and constraints rather than importing process for its own sake

Help establish shared tooling, templates and review cadences that work consistently across silicon, hardware, manufacturing and software workstreams

5+ years in technical project management, operations, supply chain, or programme management in semiconductors or complex hardware

Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers

Strong understanding of semiconductor production and packaging flows

Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution.

Experience using tools such as Jira, Confluence, Linear, Asana, Smartsheet, MS Project or PLM systems

Experience working in a rapidly scaling organisation building process on the way

Experience in the following areas would be an advantage:

Advanced packaging, high-performance compute, chiplets, 2.5D/3D integration, or HBM-based packages.

Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp.

Working with Asian semiconductor supply chains and partners.

Highly organised with strong prioritisation discipline

Structured thinker with rigorous risk management instincts

Clear, concise communicator able to operate confidently with both engineers and executives

Founded in 2022, team of 100+ which is expanding rapidly

Modern, open offices in London and Bristol

Collaborative, problem-solving culture built on deep curiosity, entrepreneurial initiative and technical fluency

Full-stack engagement: Our teams include some of the UK’s leading technologists and leaders across hardware, software, silicon, and system modelling, all work closely together to create a product with global, generational impact

Certain roles may involve working on technologies subject to export restrictions. Applicants may be required to undergo additional eligibility checks to ensure compliance with applicable law.