Lead Process Engineer

Qualifications

• Due to compliance with U.S. export control laws and regulations, candidate must be a U.S. person, which is defined as, a U.S. citizen, a U.S. permanent resident, or have protected status in the U.S. under asylum or refugee status.
• YOU MUST HAVE
• Bachelor of Science Degree in Engineering, Physical Science, or Physics related discipline.
• Seven years (7) years of process engineering experience and knowledge of Electrical/RF Engineering.
• Ability to obtain and maintain a security clearance.
• Excellent written and oral communication skills.
• Master’s degree in engineering, Physical Science, or Physics related discipline.
• Ten (10) years’ process engineering experience
• Aerospace and Defense industry experience
• WE VALUE
• The annual base salary range for this position is $139,000 - $174,000. Please note that this salary information serves as a general guideline. Honeywell Aerospace considers various factors when extending an offer, including but not limited to the scope and responsibilities of the position, the candidate's work experience, education and training, key skills, as well as market and business considerations.

BENEFITS

• Beyond a performance-driven salary, you'll work alongside dedicated experts on technology that's advancing aviation. As a Honeywell Aerospace employee, you're eligible for a comprehensive benefits package that includes:
• Employer-subsidized medical, dental, vision and life insurance
• Short-term and long-term disability coverage
• 401(k) match, flexible spending accounts and health savings accounts
• Employee assistance program and educational assistance
• Parental leave and 12 paid holidays
• Paid time off for vacation, personal and sick time
• Explore your benefits: https://honeywellaerospacebenefits.com/
• POSTING TIMELINE
• The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates.

ABOUT US

KEY RESPONSIBILITIES

• Oversee multiple process labs in the downstream process and support development, supplier source selection and resolve production difficulties related to any of the following:
• Laser and seam seal of microelectronic packages
• Laser cutting of duroid and absorber materials using fiber lasers
• Laser cutting and drilling of ceramic materials using Co2 lasers
• Seam Seal of kovar packages
• Paint and marking of electronic assemblies
• Epoxy adhesives, Room Temperature Vulcanizing (RTV) compounds, and thermal transfer compounds
• Interface with electrical engineers, mechanical engineers and material suppliers to modify and enhance manufacturability of products; accountable for yields of highly complex processes.
• Develop processes within design guidelines that promote process capability including creating, checking and releasing formal documentation.
• Perform detailed Design of Experiments (DOE) and analyze results using statistical methodology, document and evaluate processes.
• Provide fixture design concepts to mechanical engineering and drafting.
• Actively participate in design review gates from concept, development, prototype to production readiness
• Mentor and guidance to less experienced process engineers.
• Participate in safety training and comply with safety policies and practices.
• Collaborate in team meetings and activities as appropriate.
• Perform other related duties as assigned.
• Perform detailed Design of Experiments (DOE) and analyze results using statistical methodology, document, and evaluation processes.
• Mentor and provide guidance to early career process engineers.