Lead Design Engineer

Development, automation and maintenance of EDA flows and scripts for physical implementation

Develop TFM to optimize PPA for IP’s and Soft Controllers

PPA characterization and optimization of flow for performance-oriented and power-oriented best-in-class IP cores in advanced process nodes, on TSMC, Intel, Samsung and Rapidus Foundries

Manage regression infrastructure that tracks quality of the RTL/flow development as well as the PPA of the key designs.

Digital design implementation using Cadence EDA tools - Genus, Innovus, Conformal, Litmus, Tempus, Voltus, Certus, Pegasus and other backend tools

Candidate will be working on automation of Full chip floorplanning using latest AI tools. Involving in active AI agent based partition for Full Chip Floorplanning.

Required skills –

Educational Qualification: MS/MTech/BE/ BTech in Electronics from reputed institutes with 5 + years' experience

Physical design experience in ASIC design environment

Should have knowledge of complete ASIC Design Flow, including Synthesis, Physical Designing, Timing Analysis, Power Analysis and Formal Verification

Should have excellent leadership, communication, analytical and problem solving skills.

Expertise on High frequency design methodologies for complete ASIC backend flows.

Candidate with experience in Full Chip (SoC level) floorplanning, pin assignment, global clock distribution across all subsystems is a plus point.

Good communication skills, strong analytical problem solving skills and willingness to learn quickly.

Solid scripting skills including Python and Tcl.

Should be self-motivated and good team player.