{bc}
oracle

Failure Analysis Engineer

onsemi
Tempe, USA
Full-time
Mid · 5+ years experience
Onsite
Discovered 6 days ago
Communication

Full Job Posting

Qualifications

  • Bachelor's degree or higher in Electrical Engineering, Materials Science, Physics, or a related engineering discipline; Electrical Engineering preferred.
  • 5+ years of semiconductor failure analysis, product analysis, or advanced materials characterization experience required.
  • Strong understanding of electrical characterization, fault localization, and semiconductor failure mechanisms.
  • Experience with one or more advanced failure analysis techniques such as PEM, OBIRCH, EOP, EOFM, Microprobing, Nanoprobing, EBIC, EBAC, scan diagnosis.
  • Ability to handle and manipulate very small semiconductor samples during laboratory and chemical processing operations.
  • Strong analytical and problem-solving skills with the ability to independently lead complex technical investigations.
  • Excellent written and verbal communication skills with the ability to clearly communicate technical findings to both technical and non-technical audiences.
  • Ability to prepare concise, high-quality technical reports and presentations.
  • Ability to manage multiple investigations simultaneously while maintaining high-quality results and meeting customer expectations.
  • Demonstrated ability to work effectively in a collaborative, team-oriented environment.
  • Experience mentoring, coaching, or providing technical leadership to other engineers is highly desirable.

Responsibilities

  • Perform electrical and lead physical failure analysis investigations on customer returns and internally generated failures arising from qualification, reliability, design debug, manufacturing, and technology development activities.
  • Develop comprehensive analysis strategies using background information such as electrical test results, ATE data, reliability information, imaging results, application knowledge, and design data.
  • Characterize the failure modes using semiconductor parameter analyzers, oscilloscopes, logic analyzers, function generators, application boards, automated test equipment and other advanced laboratory instrumentation.
  • Utilize fault localization techniques such as Photon Emission Microscopy (PEM), Optical Beam Induced Resistance CHange (OBIRCH), Electro-Optical Frequency Mapping (EOFM), Electro-Optical Probing (EOP), microprobing, nanoprobing, scan diagnosis, and related methodologies to localize failure sites.
  • Direct and interpret physical and materials characterization activities utilizing SEM, FIB, TEM, EDS, FTIR, X-ray, CT imaging, and advanced sample preparation techniques.
  • Correlate electrical characterization, fault localization, physical analysis and materials characterization results to determine root cause and clearly identify failure mechanisms.
  • Prepare clear, concise, and data-driven technical reports that effectively communicate analytical findings and support 8D problem-solving activities.
  • Present analytical findings and recommendations to cross-functional engineering teams, management and customers as required.
  • Develop and implement new analytical methodologies, workflows, and laboratory capabilities to address emerging technologies and increasingly complex failure mechanisms.
  • Provide technical leadership, mentorship, and training to engineers and technicians while helping establish best-known analytical practices across the laboratory.

Preferred Qualifications

  • Bachelor's degree or higher in Electrical Engineering, Materials Science, Physics, or a related engineering discipline; Electrical Engineering preferred.

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