Fabrication Backend Process Engineer, Quantum AI

Responsibilities

• Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction.
• Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization.
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement.
• Partner closely with other teams (e.g., design, test, frontend, packaging) to integrate new backend modules into devices, develop and refine device probing, packaging, and measurement methodologies, and ensure successful product delivery and customer satisfaction. - Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization. - Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals. - Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations. - Analyze process data to identify trends, improve stability, and drive continuous yield improvement.

Minimum qualifications:

Preferred qualifications:

Qualifications

• Minimum qualifications: - Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. - 1 year of experience in a wafer level or die level cleanroom environment. - 1 year of experience with one or more of the following: SPC (statistical process control), Electrical test (Probing), Metrologies (SEM, XPS, Interferometry), or Failure analysis. - 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement. Preferred qualifications: - Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). - Experience with developing novel bump materials, scaling up die sizes, flip-chip bonding or designing structural bonding solutions. - Experience with characterization techniques including SEM, XPS, confocal microscopy, and interferometry. - Experience with statistical process control and failure analysis activities. - Experience with data analysis and visualization tools such as JMP, Python, or SQL.