Director, Package Design Engineering
Full Job Posting
Qualifications
- Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
- 15 to 20 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging
- Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software
- Knowledge of wire-bonding & multi-chip module technologies a plus.
- Strong interpersonal and communication skills.
- Strong analytical and presentation skills.
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