Design Lead (HBM/Advanced Memory Design)

Overview

Key Responsibilities

• Lead the design and execution of sophisticated memory subsystems and top-level integration activities.
• Own design planning, technical decision-making, risk assessment, and schedule execution.
• Coordinate with architecture, verification, layout, DFT, and product engineering teams to ensure design quality and manufacturability.
• Review design specifications, microarchitecture documents, and implementation plans.
• Drive memory array design, including address decoders and data path, internal power supplies, and custom circuit design activities depending on project needs.
• Lead design reviews and drive issue resolution across organizations.
• Guide engineers who are developing their skills and provide technical leadership to project teams.
• Define and improve building methodologies by applying AI-enabled tools, automation, and guidelines.
• Support silicon bring-up, debug, characterization, and yield improvement activities.
• Communicate project status, risks, and mitigation plans to management and collaborators.

Required Qualifications

• BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
• 10+ years of semiconductor design experience.
• Demonstrated experience leading complex IC development programs.
• Strong understanding of digital and/or custom circuit design methodologies.
• Experience with memory array design, address decoders, and datapath architecture.
• Experience with power delivery and repair schemes.
• Experience with verification and debug flows.
• Experience with DFT and silicon validation.
• Experience with power, performance, area, and thermal optimization.

Preferred Qualifications

• Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
• Experience leading global multi-functional teams.
• Knowledge of advanced process nodes and design-for-manufacturing concepts.
• Experience with Synopsys and Cadence implementation flows.
• Familiarity with package integration, 2.5D/3D stacking, TSV, and advanced packaging technologies.
• Consistent track record of successful product tape-outs.

Leadership Expectations

Success Metrics

Benefits

• Choice of medical, dental and vision plans in all locations.
• Benefit programs that help protect income if unable to work due to illness or injury, and paid family leave.
• Robust paid time-off program and paid holidays.