CLAWS Packaging Engineer

About the Department

• Medical , Dental , and Vision

• Retirement Programs
• Disability Plans
• Life Insurance
• Accident Plan
• Paid Time Off and Other Leave Programs

• Tuition and Academic Assistance
• And so much more!

• RF devices including HEMTs and MMICs
• High power electronic devices including HEMTs, FETs, and diodes
• Visible spectrum optoelectronic devices and Photonic Integrated Circuits.
• Specify package solutions that meet the performance requirements of new technology platforms in collaboration with CLAWS teams.
• Define scalable workflows to realize packaged discrete devices, integrated circuits, or modules.
• Participate in cross-functional design initiatives that improve performance, manufacturability, yield, or reliability.
• Lead the development and integration of processes in, for example, die attach, wire bonding, and encapsulation.
• Analyze package and module performance. Inform electrical, thermal, and mechanical simulations with design and characterization data.
• Troubleshoot process integration challenges related to defectivity, yield, and reliability.
• Collaborate with circuit designers, applications engineers, and product development teams to realize integrated system-level advantages.
• Stay up to date with emerging technology trends, competitive landscape, and industry benchmarks.

• Comply with stated workplace policies.
• Communicate results, plans, and other updates to a variety of audiences.
• Adhere to and mentor others in known best practices.
• Support CLAWS activities such as tours, meetings, and conferences.

• Ph.D. or relevant terminal degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; or
• Master’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 5 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).
• Bachelor’s degree in Electrical Engineering, Materials Science, or a related field with a focus on semiconductor high power, RF, or photonics devices; with at least 8 years of experience in high power, RF, or photonics device packaging and process integration (industry or research).

• Experience designing and implementing packaging processes for high power, RF, or photonics applications.
• Excellent communication and interpersonal skills.
• Ability to multitask and meet deadlines with moderate supervision.
• Ability to follow safe procedures for working with semiconductor packaging or fabrication equipment, chemicals, and compressed gas cylinders.
• Comfort in collaborating with students, faculty, and staff of varying experience and backgrounds.
• Eligibility to obtain clearance upon request of the US government.

• Modeling thermal, electrical, or mechanical behavior(s) in packaged devices
• Characterization of devices and processes, including failure analysis and defect inspection.
• RF or optical signal integrity.
• Advanced packaging architectures.
• Design for reliability and reliability testing.
• MES and SPC systems.
• Statistical methods (e.g., DOE , GR&R) and tools (e.g., JMP , Minitab).
• Material specification and vendor management.

• N/A

Full Time Equivalent (FTE) (1.0 = 40 hours/week)