ALD Thin Film Process Development Engineer

Qualifications

• Minimum requirements:
• Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• 5+ years relevant experience in 300mm Advanced (<32nm) logic device or advanced memory device technologies
• Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD
• Strong supplier engagement skillset
• Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies
• Preferred qualifications:
• 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products
• Working knowledge of advanced CMOS device physics and reliability mechanisms
• Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals
• Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms
• Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems
• Direct R&D experience in 300mm semiconductors
• Experience with HKMG, Silicon Photonics
• Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization
• Data analysis skills
• Ability to work in teams and collaborate effectively with people in different functions and locations
• Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery
• Minimum requirements: - Master’s degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field - 5+ years relevant experience in 300mm Advanced (<32nm) logic device or advanced memory device technologies - Working knowledge of Process development, characterization and control of Thin films processing equipment, CVD, PE-CVD, Single-wafer ALD - Strong supplier engagement skillset - Strong foundation in statistical process control, Design of Experiments (DOE), data analysis, model-based problem solving, engineering change control, and process release strategies Preferred qualifications: - 5 years relevant experience in 300mm Advanced logic of advanced memory device technologies: Specific experience on RMG products - Working knowledge of advanced CMOS device physics and reliability mechanisms - Hands on Process Experience across multiple 300mm deposition platforms for dielectric, High-K and Metals - Experience with Single-wafer ALD such as ASM XP4 Pulsar & XP8 platforms, as well as Batch ALD platforms - Familiarity with 300mm Semiconductor Single wafer Thermal, RTA, Laser Anneal systems - Direct R&D experience in 300mm semiconductors - Experience with HKMG, Silicon Photonics - Device physics training with understanding of materials, material evolution; structural characterization and electrical test characterization - Data analysis skills - Ability to work in teams and collaborate effectively with people in different functions and locations - Strong relationship-building, communication, time management, and results-oriented collaboration skills to enable on-time project delivery